MICRON TECHNOLOGIES will produce HBM2 memories in 2020


     

    Micron Technologies, in the latest earnings report, announced it will start producing DRAM High-Bandwidth Memory 2 (HBM2). Used for high performance graphics cards, server processors and all types of CPU, memory HBM2 it is a sought-after and relatively expensive solution, however, when Micron enters this market segment, it will necessarily have to be competitive if it is to maintain good profits. Previously, only SK-Hynix and Samsung produced the HBM2 DRAMHowever, Micron Technologies will join them to form a new group of three major companies that could dominate the memory market.



    MICRON TECHNOLOGIES will produce HBM2 memories in 2020

    Until now, Micron had all hopes for its type DRAM Hybrid Memory Cube (HMC) owner, niche product that has not been able to earn the trust of customers without ever taking off. the Fujitsu SPARC64 XIfx CPU in fact, used in the supercomputer Fujitsu PRIMEHPC FX100, was introduced in 2015. Micron announced to discontinue production of HMC DRAMs in 2018 and decided to devote its efforts to the development of GDDR6 and HBM. The first products of the new production segment are expected to be launched as early as 2020.



     

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